We introduced the latest research and development results regarding the ongoing project for heterogeneous material integrated optoelectronics* at interOpto2023 held at Tokyo Big Sight.
We exhibited eight panels introducing research results, and also InP chip/Si wafer bonded samples and prototypes of optical DAC transmitters/TIA-less receivers, which attracted many people.
*Project for Technology Development of High Efficiency and High Speed Processing Distributed Computing System using Heterogenous Material Integrated Optoelectronics
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| 【Exhibition scenery】 | |